Xinzhizao universal IC thermal insulation tin pad with XZZ C1 magnetic base for mobile phone BGA IC tin planting reballing soldering repair. XZZ high temperature resistant silicone pad for most mobile phone IC chips with a thickness of less than 0.9mm.

Option:
1. XZZ tinning silicone pad.
2. XZZ C1 magnetic base.
3. XZZ magnetic base with silicone pad.

Features:
1. The slope design allows for better chip fit, is compatible with thinner chip ICs, and the pads are not suspended and are more uniform.
2. Strong magnetic properties and stable chip steel mesh. Paired with the Xinzhizao C4 base, the magnetism is strong, and the heat insulation pad has no loss of magnetism, which can make the base firmly absorb the chip steel mesh and facilitate tin planting.
3. XZZ heat insulation tin planting pad, soft material, full of toughness, can be twisted, folded, stretched at will, convenient to store, and durable.
4. Magnetic tin planting platform, high temperature resistant silicone pad. High temperature resistant, high toughness, good permeability.
5. Fully fit the C4 base, strong magnetism allows the chip to fit, not move, and convenient for tin planting.
6. Suitable for chips with a thickness of less than 0.9mm, and most of the current mobile phone chips for auxiliary tin planting.
7. Strong heat insulation performance, safe tin planting, layered heat insulation, multi-layer heat dissipation, high temperature resistance, and strong heat insulation performance.

Product Information:
Brand: XZZ.
Name: Thermal insulation tin pad.
Pad Size: 60*80*3mm.
Support Model: Support tin plating on most chips.